IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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D-Sub Pin-in-Paste Connectors
FCI Basics D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors. Pin-in-Paste technology (PiP) allows the use of Through Hole products in SMT manufacturing processes. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
D-Sub Power Board-Mount Connectors
FCI Basics D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10 to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts feature colour-code plastic clips for easy wire gauge identification.
D-Sub Press-Fit Connectors
FCI Basics D-Sub Press-fit Connectors are available in single-shell Delta-D, high density, and mixed power designs, saving the cost of an additional wave soldering. The "Eye of the Needle" termination technique combined with a unique flat-rock design supports easy application by pressure on the insulator. Insertion kits are available for the process.
D-Sub Slimline
ULTRA SLIM D-SUB CONNECTORS
FCI Basics has expanded the D-Sub connectors with a modified ultra-slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.
D-Sub SMT Connectors
D-Sub connectors are now available with Surface Mount Termination (SMT) in standard form factors. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate SMT soldering. The products are UL recognized and lead-free.
D-Sub Standard Density Connectors
Amphenol ICC's D-Subminiature standard density product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
D-Sub Waterproof Connectors
Amphenol ICC's IP67 Waterproof D-Subminiature product line offers the terminations for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight and Right Angle for the board side and Solder Cup for the cable side. Each termination variant has both socket and plug connectors.
Dubox® 2.54mm
The Dubox®, connector family offers an extensive range of through-hole and surface-mount part options. It is available in single or double-row in both straight and right angle orientations from 2 to 50 positions, with a maximum current rating of 3A per individual contact. This cost-efficient solution offers high reliability in electrical performance.
Dubox® 2.54mm Crimp to Wire
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
DVI Connectors
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. These DVI Connectors have a copper alloy, gold-plated contacts, and steel, nickel-plated shell.
EconoStik™ 2.54mm
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
EMI Gasket Bulkhead Connectors and Adapters
SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
eSATA Connectors
eSATA connectors are designed for external storage applications that require a single-lane Serial ATA cable connection up to approximately two metres in length. The connectors comply with the Serial ATA Specification issued by the Serial ATA International Organization (SATA-IO). eSATA connectors support both Gen 1 (1.5Gb/s) and Gen 2 (3Gb/s) SATA data rates.
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX+® High Speed Backplane Connector System
The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.
ExaMAX® 56Gb/s High Speed Backplane Cable Assembly
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® 56Gb/s High-Speed Backplane Connector 85Ohm
The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.