IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Armored RF Cable Assemblies
SV Microwave offers a range of armored RF cable assemblies designed to excel in challenging conditions, especially in applications like ground vehicle communications systems. Cable assemblies are available in both fully and partially armored configurations, these can deliver outstanding resistance to corrosion and crushing.
ASGTC-Q
ASGTC-Quadrax is a special circular bayonet coupling connector for data line transmission in RMT application, It's IP67 protection and with a self-locking system specially designed in order to get heavy duty application, Q-contacts with the protection of copper body and multipoints band in female contact to provide to 360º shielding.
BarKlip® BK100 I/O
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK150 Connector
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance connectors.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BarKlip® XP Connectors
HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR
Amphenol's BarKlip® XP connectors feature independent points of contact that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications.
Barrier Terminal Blocks
EBY offers a complete selection of industry standard terminal blocks and barrier strips - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
For bare or terminated wires
Wire-to-board or wire-to-wire feed-through styles
No special tools required for installation
Easy field termination
Flexible design options - contact us!
BergStak HS™ 0.50mm Mezzanine Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes.
The BergStak HS™ 0.50mm connector series meets the new 25Gb/s and 32Gb/s performance requirements.
BergStak HS™ 0.80mm Board-to-Board Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm Mezzanine Connector
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
BergStak® 0.50mm Self-Alignment Board-to-Board Connector
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
BergStak® 0.80mm Pitch
FLEXIBLE SOLUTION FOR HIGH-DENSITY APPLICATIONS
FCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
BergStak® 0.80mm Shielded Board-to-Board Connector
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
BergStak® FX10 0.50mm Board-to-Board Connector
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.
BergStak® Secure Connector
HIGH SECURITY/HIGH DENSITY/HIGH-SPEED BOARD-TO-BOARD CONNECTOR
The BergStak® Secure connector contains One-time-use and Multi-times-use solutions. Both solutions have unique shield designs to protect signal transmission. The 3-row contact design with 1.0mm pitch improves board surface utilization by 20%. The family can support high-speed data transmission up to 32Gb/s.
BergStik® 2.54mm
BergStik® FCI Basics 2.54mm unshrouded headers are available in SMT, THT, press-fit, stacking, and PIP versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Featuring a "breakaway" design, each connector can be cut or broken into lengths to suit the application profile with a maximum current rating of 3A per contact.
Blind Mate MCIO
Amphenol's Blind Mate MCIO is designed for high speed and high density. It can support PCIe Gen5, and is scalable to PCIe Gen6. We designed Blind Mate MCIO with a guide pin to prevent damages during plug in and plug out. Blind mate MCIO has a robust mechanical design, and the connector can be fixed by a screw-on panel.
BMB RF Interconnects
SV Microwave’s latest product line offers a comprehensive range of RF interconnects, including standard and bulkhead cable connectors for a variety of cable types and PCB connectors ideal for use in board-to-board solutions, with connectors in both Full Detent and Smooth Bore options, as well as a bullet. This product line is rated to work up to 22 GHz, ensuring reliable and high-performance RF solutions.
Board-to-Board 100Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets SAS 3.0, 12GT/s.