IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
DIN IDC Cable Connectors and Cable Assemblies
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21, and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system.
Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
The 0.80mm pitch DDCE connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single-piece connector can accommodate both high-speed and low-speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In- Card thicknesses.
DSFP 56G PAM4 SMT Connector
DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.
D-Sub Accessories
FCI Basics D-Sub Accessories complement FCI Basics D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories includes plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, dust caps, and brackets.
D-Sub Cable Connectors
FCI Basics D-Sub Cable Connectors span across signal and power applications in computer equipment, cash register, and high-end industrial cabinets. Signal connectors are available as removable crimp contacts, and power connectors in crimp, solder bucket, and wire wrap terminations.
D-Sub Dual Port Connectors
Amphenol ICC's D-Subminiature product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
D-Sub Economy Range Board-Mount Connectors
FCI Basics D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have guaranteed durability of 50 mating cycles. Board connectors are available in straight and right-angle versions, while cable connectors are available in solder bucket and crimp styles.
D-Sub High Density Board-Mount Connectors
FCI Basics D-Sub High-Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly, and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
D-Sub High Density Connectors
Amphenol ICC's D-Subminiature high-density product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
D-Sub High Density Connectors
The I/O connection system has been a common interface to electronic applications for a long time. These products are applied to nearly all markets & applications, from industrial control to telecommunications. ALTW D-Sub connectors are developed in 5 different standard housing fit for standard/high-density pin contact & sealed for ingress protection up to IP68.
D-Sub Hybrid Connectors
Amphenol ICC's TW Hybrid D-Subminiature connectors offer a wide range of termination options for board and cable ends, bringing up an overall solution of cable and PCB assemblies. The terminations include Straight and Right Angle for the board side, and Solder Cup and Crimping (for power pin only) for the cable side. Each termination variant has both socket and plug connectors.
D-Sub MicroTCA Connectors
FCI Basics D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost.
D-Sub Pin-in-Paste Connectors
FCI Basics D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors. Pin-in-Paste technology (PiP) allows the use of Through Hole products in SMT manufacturing processes. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
D-Sub Power Board-Mount Connectors
FCI Basics D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10 to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts feature colour-code plastic clips for easy wire gauge identification.
D-Sub Press-Fit Connectors
FCI Basics D-Sub Press-fit Connectors are available in single-shell Delta-D, high density, and mixed power designs, saving the cost of an additional wave soldering. The "Eye of the Needle" termination technique combined with a unique flat-rock design supports easy application by pressure on the insulator. Insertion kits are available for the process.
D-Sub Slimline
ULTRA SLIM D-SUB CONNECTORS
FCI Basics has expanded the D-Sub connectors with a modified ultra-slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.
D-Sub Waterproof Connectors
Amphenol ICC's IP67 Waterproof D-Subminiature product line offers the terminations for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight and Right Angle for the board side and Solder Cup for the cable side. Each termination variant has both socket and plug connectors.
Dubox® 2.54mm
The Dubox®, connector family offers an extensive range of through-hole and surface-mount part options. It is available in single or double-row in both straight and right angle orientations from 2 to 50 positions, with a maximum current rating of 3A per individual contact. This cost-efficient solution offers high reliability in electrical performance.
Dubox® 2.54mm Crimp to Wire
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.