With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.
Metral® FCI Basics HDXS is a cable-to-board connector designed for high-end telecom applications including Telecom Access Equipment and Base Stations. Metral® HDXS is designed with minimum guaranteed clearance and creepage distances to comply with ANSI requirements of resistibility to overvoltages of up to 2500V. It is ideal for use in ADSL/VDSL for harsh environments.
Metral® High Speed 2000 Series Backplane Connectors
FCI Basics Metral® 2000 Series is a high-speed 2mm backplane connector system of vertical headers. The 2000 Series features a unique stripline structure that allows having improved signal performance when routed in either a single-ended or a differential pair configuration.
Metral® High Speed 4000 Series Backplane Connector
FCI Basics Metral® 4000 Series is a high-speed 2mm backplane connector system consisting of right-angle receptacles and vertical headers. The 4000 Series features a unique stripline structure in both the receptacle and header. Compared to the Metral® 1000 and 2000 Series, Metral® 4000 receptacle connectors employ a modified receptacle contact geometry optimized for 100Ω differential signals.
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro Power 3.0 connector system is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 6.5A per pin and a wire gauge range from 30AWG-20AWG. It is available in 2 to 24 circuits for dual rows and 2 to12 circuits for a single row. Scoop-proof housings prevent mismating between header and receptacle.
Micro Power Plus 3.0 connector system, is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating of up to 12.5A per pin and wire gauge range from 30AWG-16AWG. It is available in 2 to 24 circuits for dual row and 2 to12 circuits for single rows.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® cable connectors in standard 5+2 row configuration, transversal mounting on pin array
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
FCI Basics Millipacs® Hard Metric Right Angle header Modules are available in all popular versions - Type A, B, C, B19, B22, AB22, and AB25 with options for top row shielding, high-temperature grade,
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
FCI Basics Millipacs® is a 2.00mm modular, Board-To-Board or Cable-To-Board Interconnection system in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with options for the outer row.
Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for a new generation small form factor system. These fine pitch solutions offer multiple BTB applications like a right angle, mezzanine, and coplanar and support cable interconnect options. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.
Amphenol ICC introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Mini Power 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 9A per pin and wire gauge range from 28AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini power super series is a 4.20mm pitch power connector designed for flexible wire-to-board applications based on different wire gauges and circuits. It provides a maximum current rating of 20A/pin and accommodates a wire gauge of 16AWG and 14AWG. It is foolproof against mismating among different circuits. This series is available in 2 to 24 circuits for dual row.