IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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EconoStik™ 2.54mm
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX® 56Gb/s High Speed Backplane Cable Assembly
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® VS High-Speed Backplane Connector
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
ExpressPort® SFP+
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
Extremeport-Flash
Amphenol’s Extremeport-Flash is an extreme low mating height, easy-to-release high-speed cable solution. We designed 95ohm Flash mainly to support near chip (under heat sink) to IO application, and the mating height is lower than 5mm. Flash can support 56G PAM4, and scalable to 112G PAM4 application, and plug is with pull tab design feature for easy release.
Extremeport-MCIO(Mini Cooledge IO)
Amphenol's Mini Cooledge IO(MCIO) is a high-speed, small mechanical size cable solution. Amphenol MCIO product is now being specified in the SFF group and the project number is SFF-TA-1016. MCIO cable can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. We developed 85ohm and 95ohm solutions to support different applications.
Extremeport-Swift
Amphenol’s Extremeport-Swift is an extreme low profile(mating height<9mm), robust mechanical, and excellent SI performance cable solution. The cable assembly and connector can support PCIe Gen5, and the SI performance is scalable to PCIe Gen6 and 112G PAM4. We can provide straight, right angle, and side exit plug types with 38pin, 74pin, and 124pin to support customers to optimize system layout.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ QSFP DD 112G Connectors
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
ExtremePort™ QSFP+
Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost-optimized solutions. The ExtremePort™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel.
ExtremePort™ SFP+
Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.
Extremeport-Z-Link(Gen Z)
Amphenol’s Extremeport Z-Link(Gen Z ) Connector is a scalable connector and connector interface compliant to SNIA: SFF-TA-1002. Z-Link can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. Z-Link can support high speed and power in one connector, and we developed 1C, 2C, 4C, and 4C+ connectors to support customers' different applications.
Extreme RF Cable Assemblies
Amphenol SV Microwave offers a complete line of fixed length, high-frequency Ø.047" and Ø.085" cable assemblies in series: SMA, 2.92mm, 2.4mm, 1.85mm, SMP, & SMPM. These assemblies feature low solder wicking, and the high flexibility allows for tight bends behind the cable ferrule. Our low loss is your gain!
F2X Fiber Optic Building Entry Point
The building entry point (BEP) enables easy connection of buildings to your fiber optic network. The BEP can accommodate different numbers of fibers according to your needs. With the patented F2X® solution you are able to connect and measure FTTX installations faster.